Release Base Films

Series 7：Release Base Films

core advantage

Excellent High-Temp Stability: Dimensionally stable, low precipitation substrate for high-temperature manufacturing processes (protective & release films).
Eco-Friendly & Safe: Silicon-free & fluorine-free self-release films, complying with environmental standards to avoid sensitive material contamination.
Controllable Release Force: Release force range 300–900g/mm, customizable per customer process.
Optimized Surface Properties: Tunable surface energy to fit lamination with various adhesives.

Main application fields

FPC/PCB field

Release and protection during high-temperature lamination process, with a temperature resistance of > 180℃

Adhesive tape industry

Release substrates for high-performance tapes (such as OCA, double-sided tape)

Die-cut protection

Surface protection during the precise die-cutting process to prevent scratches and contamination

Printing industry

Temporary carriers for digital printing and screen printing, easy to peel off without residue

Typical product parameters

Product Model ColourThickness range(μm) Typical Value
Thickness(μm)Light Transmittance%Haze%Features
BX06 Matte 6~36 36 84 33Matte grade film features excellent processability and superior dimensional stability. It can be applied for long-term service under high-temperature environments with low low-molecular precipitation. No low-molecular substances separate out at 180°C, preventing contamination of the carrier substrate.
KHX210Transparent 25~100 50 87 6.0Transparent grade film delivers reliable dimensional stability and outstanding heat resistance. It remains crack-free under high temperature and high pressure ranging from 180°C to 220°C.
KHZL12 Matte 15~75 50 —- 40Matte internally compounded release film, non-silicone and non-fluorine type, compliant with environmental protection requirements. No residue, no transfer, and does not affect the surface performance of the substrate. Release force: 300–900g.

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